The trend toward miniaturization in the field of electronics manufacturing continues with smaller components being placed in even more compact spaces. As a result, the demand for solder pastes containing smaller metal particles is increasing.

All of our recent solder paste products are standardized to powder size Type 4, but we also offer solutions in T5 and T6 to overcome challenges related to ultra-fine pitch electronics manufacturing.

Since the demand for solder pastes with ultra-fine powder size is still relatively low and highly specific, we are further developing products based on the needs and requests of our customers. Please contact us for more details on the availability of powder size related to a specific alloy and in combination with our Ecorel™ flux medium. We are flexible and can develop products according to your specific requirements.

PRODUCT OVERVIEW

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