Jet Printing Solder Paste

Our jet printing solder pastes are especially designed to work on jet printing equipment and to guarantee continuous and consistent deposits of solder paste.

Although the flux is chemical inert, it is easy to clean with water or solvent based processes. It is optimized to be used on Mycronic, Vermes, Essemtec and Musashi jet printing equipment.

Dispensing Solder Paste

Dispensing solder paste is a very flexible manufacturing process, allowing solder pastes to be put into cavities and on top of mounted components. Furthermore different dot sizes can be achieved within a single process setup.

Our dedicated jet printing & dispensing solder pastes offer optimized flow properties and viscosity ranges to achieve best results using these manufacturing processes.

Low and No silver solder solutions are often selected to reduce cost but a reduced silver content can also improves substantially the drop shock performance of an electronic assembly.

Typical applications where drop shock is important are consumer electronics and more particular, handheld devices. In recent years however, we see these alloys also used in industries as Automotive & Energy.

The alloy characteristics in combination with the high performance chemistry of the ECOREL™ range provides very good wetting and a robust assembly process for high volume electronics.

Breakthrough technologies have enabled a wider use of low temperature solder (LTS) processes and in recent years they are used increasingly as an alternative to SAC305 assemblies.

The benefits are not limited to soldering temperature sensitive components as also board to board warpage is significantly reduced, it opens up the possibility for a single pass process and provides more design freedom.

From an environmental & cost perspective, LTC reduces energy use substantially and hence CO2 emissions.

Voiding in solder joints is a concern in high reliability electronics like automotive, power electronics, LED lighting, etc, as electrical conductivity and thermal dissipation performance are lowered if the percentage and the size of voids are too high. Also voids could reduce the mechanical strength of the joint.

Large area components such as bottom termination components (BTC) and components with bottom thermal plane (DPAK) are particularly critical. So the reduction of voids level and voids size is very important to achieve the expected reliability in such assemblies.

Many factors are responsible of voiding, including the solder paste as voids being partly caused by flux outgassing which remain entrapped in the solder joint. In order to reduce the voids level in an electronic assembly, using a dedicated low voids solder paste is recommended.

The trend toward miniaturization in the field of electronics manufacturing continues with smaller components being placed in even more compact spaces. As a result, the demand for solder pastes containing smaller metal particles is increasing.

All of our recent solder paste products are standardized to powder size Type 4, but we also offer solutions in T5 and T6 to overcome challenges related to ultra-fine pitch electronics manufacturing.

Since the demand for solder pastes with ultra-fine powder size is still relatively low and highly specific, we are further developing products based on the needs and requests of our customers. Please contact us for more details on the availability of powder size related to a specific alloy and in combination with our ECOREL™ flux medium. We are flexible and can develop products according to your specific requirements.

Printing and soldering results can differ through impacts caused by equipment & equipment settings, stencil qualities, reflow methods and much more.

Our robust assembly solder paste range offers paste solutions optimized for a larger process window, reproducible reflow results and well balanced overall performance.

ECOREL™ water-soluble solder pastes combine optimized wetting properties together with great printing performance.

Remaining flux residues can mostly be cleaned using DI-water, but when better cleaning results are required, we can offer efficient defluxing solutions perfectly matched with our flux formulation and showing great material compatibility.

Besides, SMT-stencils can on average be easily cleaned with DI-water or just with a small amount of cleaning detergent.