Voiding in solder joints is a concern in high reliability electronics like automotive, power electronics, LED lighting, etc, as electrical conductivity and thermal dissipation performance are lowered if the percentage and the size of voids are too high. Also voids could reduce the mechanical strength of the joint.

Large area components such as bottom termination components (BTC) and components with bottom thermal plane (DPAK) are particularly critical. So the reduction of voids level and voids size is very important to achieve the expected reliability in such assemblies.

Many factors are responsible of voiding, including the solder paste as voids being partly caused by flux outgassing which remain entrapped in the solder joint. In order to reduce the voids level in an electronic assembly, using a dedicated low voids solder paste is recommended.

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