As some electronics are used for people’s safety or expected to operate under extreme conditions for many years, standard solder pastes may technically not be up to the task resulting in premature failure of the electronics.

CHEMICAL RELIABILITY

Most no-clean flux residues after reflow are chemically inert to only some extend and cleaning or in other words, defluxing is an option still not always desired.

Inventec targeted from the early days high reliability applications. We were one of the first companies providing halogen-free formulations and to use BONO test to confirm the reliability of our solder products. This allowed us to fine-tune over those years well balanced solder solutions with highly inert flux residues.

MECHANICAL RELIABILITY

The strength of the solder joint is defined by the mechanical reliability properties of the alloy. Some electronic assemblies have to deal with fast and extreme temperature changes, high temperatures, vibrations or need some resistance to drops. Choosing the right alloys for a particular need is key.

In the past, leaded alloys where the solution to electronic assemblies exposed to extreme temperature changes but due to environmental concerns they have been prohibited to use (with a few exceptions). Lead free alternatives, like SAC405, SAC378 and other variations have been introduced over the years. Inventec’s R&D team is constantly looking for improvements in this field.

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