Sintering Solutions

Our high performance pressure and pressureless sintering pastes for Die attach and substrate bonding.

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ECORELSINTEC


Sintering Solutions

The future of power electronics assembly, overcoming today’s limits

Sintering solutions are used as an alternative to solder paste power electronics in applications where high thermal and electrical conductivity, reliability, and mechanical strength are critical.

Some key areas where sintering is preferred include lead free die-attach, large area module attach, E-Vehicle, Energy conversion of Renewable energies, Optoelectronics and RF power devices.

Especially with the latest SiC and GaN developments operating at much higher power, using sintering interconnections with higher thermal and excellent electrical conductivity is crucial.


Key Advantages of our ECOREL™ SINTEC product range

  1   High Thermal conductivity
ECOREL™ SINTEC sintering solutions achieve thermal conductivity values exceeding 300 W/mK,
providing exceptional heat dissipation and making them an ideal choice for high-power applications.

  2   High shear strength
With a shear strength exceeding 50 MPa, robust interconnects are formed, enabling assemblies to easily
withstand Thermal Cycling Testing (TCT) from -55°C to +125°C for over 1000 cycles.

  3   Room temperature storage
Most sintering pastes require refrigerated or frozen storage, but our sintering solutions can be stored
at room temperature, making them much easier to handle, while still providing a 6 months shelf life.

Nano Join Technologies


Additional Advantages

  • Processing with established equipment
  • Highly reproducible and reliable
  • Low electrical resistivity (3 μΩ)
  • No CMR containing substances, no halogen and no nanoparticle
  • RoHS compliant
  • Ten-fold improvement of E-module life-time
  • Worldwide product availibilty & technical support



All-in-one Sintering Process

With ECOREL™ SINTEC AP90 it is possible to perform die Sintering & Substrate sintering in one step.
The All-in-One sintering process has the potential to reduce the total cost of ownership for such applications dramatically.
Ideally, an usually two-step process, die sintering and substrate sintering, can become a one step process: saving energy, consumables, and time by 50%.

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PRODUCT OVERVIEW

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  • Ecorel SINTEC New Product

    ECOREL SINTEC AP90

    • AG Sintering Paste
    • Low Pressure Sintering Process
    • One Step Die-& Substrate-attach
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  • Ecorel SINTEC New Product

    ECOREL SINTEC AP90D

    • AG Sintering Paste
    • Low Pressure Sintering Process
    • For Large Area Dispensing
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  • Ecorel SINTEC New Product

    ECOREL SINTEC XP95

    • AG Sintering Paste
    • Pressureless Sintering Process
    • High Thermal Conductivity & High Shear Strength
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  • Tailor-made solution

    You do not find the perfect product ? We can also offer you some tailor-made solution
    Contact Us

Technical support

Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.

Depending on your request, we provide online or onsite support

  • to select the right product based on your specific needs
  • to assist you in your product qualification process
  • to guide you with the initial set up of you process at all your worldwide manufacturing facilities
  • to provide fast response on technical issues which could occur at any time during mass production.
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Technical support
Free-of-Charge cleaning & coating trials

Free-of-Charge cleaning & coating trials

Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.

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soldering solution ?

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