Package assembly is a vital process in semiconductor manufacturing, where the semiconductor die is encapsulated in a protective package to ensure both durability and functionality.

During package assembly, electrical connections are established between the die and package leads, often using techniques such as wire bonding or flip-chip. In recent years, sintering solutions have gained prominence as an advanced bonding method within package assembly.

The integration of sintering solutions in package assembly offers several advantages, especially in high-performance applications where thermal management and electrical conductivity are critical. Sintering creates a robust, low-resistance joint between the die and the package, which enhances the overall performance and reliability of the semiconductor.

As part of package assembly, sintering solutions are used not only to attach the die to the package but also to form reliable interconnections between stacked die in advanced packaging technologies like 3D ICs or Package-on-Package (PoP) configurations.

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