For Flip Chip applications, solder bumps are deposited on the chip pads at the top side of the wafer during the final wafer processing. To mount the chip, it is flipped over to the PCB matching to the pads and reflowed to complete the interconnection.

CSP – Chip-Scale Packages are smaller than 1.2 times of the die area and are single-die direct mountable packages with typically ball pitch less than 1mm.

Our products are formulated for excellent material compatibility, great wetting properties and are easy-to clean.

Inventec has a wide range of matching cleaning solutions. Check our cleaning section for more details.