Ball Attach
POP assembly is used to combine vertically discrete logic and memory BGA packages to achieve higher component density.
The benefits are saving of PCB space and minimizing track length in between interoperating components.
During assembly, the bottom of the POP stack is directly placed on the PCB, the other package is stacked on top. The connection in between the packages and to the PCB is achieved during reflow soldering.
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ECOFREC TF48
- No clean tacky flux
- Flip Chip, spheres soldering & components rework
- Excellent printing & high viscosity
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ECOFREC TF49
- No clean tacky flux
- Flip Chip, spheres soldering & components rework
- Transparent colorless residue & high viscosity
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