Our soldering brands: Ecorel™ - Ecofrec™ - Unisphere™ - Amtech™
Our dedicated offer of solder pastes for the SMT process, combining different alloys, powder size and flux media for printing, dispensing and assemblies.
Specifically developed soldering solutions for semicon processes such as Die Attach, Ball Attach (CSP, BGA), flip chip and waferbumping, POP & SIP.
Our high performance pressure and pressureless sintering pastes for Die attach and substrate bonding.
Solder pastes, liquid and tacky fluxes, flux cleaners in an optimized packaging for re-work & repair.
Best in class liquid solvent- or the more environmental friendly water based fluxes for wave, selective soldering and tinning. Our range of tacky fluxes, including resin based, no-clean, low-residue.
Electronic corrosion reliability assessment testing. Easy, fast & cost reducing methods and tools for the detection of unwanted process residues and materials on electronic devices.