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Found
128
results
TIN-RAT
Detection of tin corrosion on PCBA
Gel test method
Easy and visual method for detecting unreacted flux residues on a printed circuit board
QUANTIFLUX
Local contamination testing
Local quantification of water soluble conductive contamination
Calibration solutions with specific known NaCl concentrations
RESIDUES-RAT
Analyses kit
Gel test
Detection of acid in flux residues presence
THERMASOLV CF1
Dielectric heat transfer fluid
Boiling point: 170°C/338°F
High critical temperature
THERMASOLV CF2
Dielectric heat transfer fluid
Boiling point: 110°C/230°F
Low GWP: <120
THERMASOLV CF3
Dielectric heat transfer fluid
Boiling point: 120°C/248°F
Low GWP: <108
THERMASOLV IM1
Dielectric heat transfer fluid
Boiling point: 61°C/142°F
Medium low GWP: 320
THERMASOLV IM2
Dielectric heat transfer fluid
Boiling point: 49°C/120°F
Ultra-low GWP: <10
THERMASOLV IM6
Dielectric heat transfer fluid
Boiling point: 47°C/117°F
Ultra-low GWP: 20
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