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99
results
PROMOSOLV COAT UT10-UV
Ultra-thin hydrophobic & oleophobic coating with UV tracer
Dipping & spray process
Easy & fast process
Available in different dilutions
3M Novec 2704 replacement
ECOREL HT 301T
Pb93,5Sn5Ag1,5 Leaded solder paste
No clean printing process
Low voids & high reliability
TOPKLEAN EL 20D
Removal of flux residues
Solvent vacuum process
Thermally and chemically stable in use
ECOREL FREE 305-28
SAC305 lead free solder paste
No clean SMT printing process
Robust assembly process
ECOREL FREE 305-31A
SAC305 solder paste
No clean SMT printing process
Excellent low voiding for DCB
ECOREL FREE 300-31A
N96,5AG3,5 lead free solder paste
No clean SMT printing process
Excellent low voiding for DCB
ECOFREC POP WS30
Water soluble tacky flux
PoP and Flip Chip process
Excellent wetting properties
ECOFREC TF48
No clean tacky flux
Flip Chip, spheres soldering & components rework
Excellent printing & high viscosity
ECOFREC TF49
Halogen free tacky flux
Flipchip & rework soldering
Low residue properties
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