ECOREL FREE 305-WS12

Excellent wetting properties

  • Sac305 lead free solder paste
  • SMT printing process
  • Excellent wetting properties
ECOREL FREE 305-WS12

Is a lead-free water-soluble solder paste especially designed for fine pitch SMT & semiconductor processes where post reflow flux removal is required. The formulation has been optimized to achieve excellent wetting and easy cleanability. The long stencil life and steady tackiness contributes to a stable process.

The chemistry of ECOREL FREE 305-WS12 is also available with other alloys and particle sizes on request.

ECOREL FREE 305-WS12

This is a product

MAIN CONTRIBUTORS WHICH REDUCE IMPACT:

HUMAN HEALTH & SAFETY

  • Lead-free alloy
  • Non-toxic & no CMR containing substances

ENVIRONMENT PROTECTION & RESOURCES SAVINGS

  • Low environmental impact: no H labelling regarding aquatic toxicity
  • Made from recycled metals, reducing substantially carbon footprint.
  • Water-cleanable formulation minimizes needs for cleaning chemicals
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Benefits

PERFORMANCE

  • High production throughput 
  • Very good wetting on all surface finishes, including OSP 
  • Excellent paste transfer volume 

COST

  • Good first pass yield testability in ICT 
  • Post soldering residues easily cleaned

HSE

  • Lead free 
  • Free of CMR containing substances
  • Greenway product

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design.

Check our product datasheet for info on process recommendations.
Be assured, our team is ready to advise and assist you in the implementation of our products.

ECOREL FREE 305-WS12 is a water-based solder paste and requires cleaning after reflow.

Check out our cleaning solutions.