Soldering

ECOREL FREE 305-WS12

Sac305 lead free solder paste
SMT printing process
Excellent wetting properties

ECOREL FREE 305-WS12 is a lead-free water-soluble solder paste especially designed for fine pitch SMT & semiconductor processes where post reflow flux removal is required. The formulation has been optimized to achieve excellent wetting and easy cleanability. The long stencil life and steady tackiness contributes to a stable process.

The chemistry of ECOREL FREE 305-WS12 is also available with other alloys and particle sizes on request.

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MAIN CONTRIBUTORS WHICH REDUCE IMPACT:

HUMAN HEALTH & SAFETY

Lead-free alloy
Non-toxic & no CMR containing substances

ENVIRONMENT PROTECTION & RESOURCES SAVINGS

Low environmental impact: no H labelling regarding aquatic toxicity
Made from recycled metals, reducing substantially carbon footprint.
Water-cleanable formulation minimizes needs for cleaning chemicals

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Benefits

PERFORMANCE

High production throughput
Very good wetting on all surface finishes, including OSP
Excellent paste transfer volume

COST

Good first pass yield testability in ICT
Post soldering residues easily cleaned

HSE

Lead free
Free of CMR containing substances
Greenway product

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design.

Check our product datasheet for info on process recommendations.
Be assured, our team is ready to advise and assist you in the implementation of our products.

ECOREL FREE 305-WS12 is a water-based solder paste and requires cleaning after reflow.

Check out our cleaning solutions.