ECOREL FREE 305-31A
Very good wetting, especially on copper surfaces
- SAC305 solder paste
- No clean SMT printing process
- Excellent low voiding for DCB
ECOREL FREE 305-31A
Is especially designed to minimize flux spattering, solder leaking and voiding to achieve consistent bond-line thickness (BLT) between the large chips and the DCB substrate. Oxide layer formation on copper surfaces causing color change is efficiently inhibited to achieve a shiny surface with nice surface cosmetics.
The chemistry of this product is also available with other alloys or particle sizes on request.
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Although fully in line with safety & environmental regulations, this product doesn’t match our strict criteria to be labelled as a Greenway product.
LOOKING FOR A MORE SUSTAINABLE SOLUTION?
GREENWAY ALTERNATIVE
- We currently don`t have a Greenway alternative but our target is to develop one in the near future. In case you want us to prioritize the development of a Greenway alternative, do not hesitate to contact us.
Benefits
PERFORMANCE
- Low voiding to achieve consistent bond line thickness
- Very good wetting, especially on copper surfaces
- Low flux spattering & low residue spread
COST
- Minimized copper oxidation for higher first-pass yield
- Minimized risks for wire-bonding defects
HSE
- No halogen
- Lead Free
- Free of CMR containing substances
Process recommandation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.