ECOREL FREE 105-VM
- SAC105 lead free alloy solder paste
- No clean smt printing process
- High volume production & robust assembly
ECOREL Free 105-VM (“Valued Manufacturing”) ”) is especially designed to cater high volume electronics with an overall balanced solder paste performance to guarantee a stable assembly process. It`s a No Clean solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECOREL™ range. Besides provides a low silver alloy a better drop-shock resistance.
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PERFORMANCE
- Robust assembly for a stable process
- Very good wetting on all surface finishes, including OSP
- Transparent colorless residue, even after multiple reflow cycles
COST
- Good first pass yield testability in ICT
HSE
- No CMR containing substances
- Lead Free & No Halogen
Process Recommendation
SOLDER PASTE PREPARATION
Put the paste in its original packaging at room temperature for at least 4 hours prior to use. Before printing, it is essential to properly mix the solder paste, either manually with a spatula or by doing several preliminary prints on the stencil. Automatic solder paste mixing is neither required nor advised.
PRINTING GUIDELINE
Apply the solder paste to the stencil to form a roll of 1 to 2 cm in diameter all along the squeegee or around 100g per 10 cm of squeegee length. This way, the solder paste will roll easily under the squeegees to offer excellent printing quality.
REFLOW GUIDELINE
This paste can be processed under air or nitrogen. Linear preheating ramp rate is recommended, however high-density boards may require a soak zone during preheating to stabilize the temperature over the circuit board before peak reflow.