ECOFREC POP WS30
- Water soluble tacky flux
- PoP and Flip Chip process
- Excellent wetting properties
ECOFREC POP WS30 is a water-soluble tacky flux designed for Package on Package process and Flip Chip process. It is suitable for lead-free and leaded soldering, with or without nitrogen.
The rheology and the tackiness of ECOFREC POP WS30 is optimized to sufficiently hold packages in place before and during reflow.
PCB cleaning is required after soldering with a water-based process.
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Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.
LOOKING FOR A MORE SUSTAINABLE SOLUTION?
GREENWAY ALTERNATIVE
- We currently don`t have a Greenway alternative but our target is to develop one in the near future. In case you want us to prioritize the development of a Greenway alternative, do not hesitate to contact us.
Benefits
PERFORMANCE
- Excellent wetting
- Great solderability with all finishes: Cu-OSP, NiAu, Immersion Sn and Ag
- Residues are easily cleaned
COST
- Helps to avoid pre-mature failures of your electronic assembly
- No flux residue cleaning required
HSE
- No CMR substances
- Non-flammable
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.