ECOFREC 200
- Solvent based no-clean liquid flux
- Wave & selective soldering
- Excellent wetting & high reliability
ECOFREC 200 is an alcohol based low residue no clean flux recommended for soldering either with air or nitrogen controlled atmosphere. Excellent soldering results within lead-free as well as leaded wave- and selective soldering processes are achieved while common solder balling issues are significantly reduced.
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Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.
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Benefits
PERFORMANCE
- Excellent wetting & through-hole filling
- Great performance for Ni/Au, Sn, Ag, HAL and OSP PCB finishes
- Exceptionally low levels of solder-ball formation
- High SIR values and passes BONO corrosion test
- Excellent pin-point testability
COST
- Helps to avoid pre-mature failures of your electronic assembly
- No flux residue cleaning required
- Highest grade alcohol formula, providing a consistent & reliable process
HSE
- Free of halide (Fluoride, Chloride, Bromide) and halogen
- Free of CMR containing substances
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.
Related products & services
ECOFREC 205
- Solvent based no-clean liquid flux
- Wave & selective soldering
- Excellent wetting on all board finishes
ECOFREC DILUENT 1