ECOREL SINTEC XP95
Pressureless Sintering Process
- AG Sintering Paste
- Pressureless Sintering Process
- High Thermal Conductivity & High Shear Strength
ECOREL SINTEC XP95
Is a pressureless sintering paste, designed for die-attach and allowing the use of standard oven equipment. It ensures optimal wetting on different DCB surface finish (Cu, Au, Ag). It is Compatible with the temperature requirement mission profiles of wide band gap material SiC and GaN.
The sintering paste does not contain halogen nor nano particle and exhibits a very high shear strength. Besides, it can be stored at room temperature without evolution of characteristics.
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PERFORMANCE
- High thermal conductivity to offer great heat dissipation
- Higher silver content without agglomeration risk
- Stable over long print-runs without degradation
- Very good wetting on all surface finishes
- High shear strength for improved reliability
- TCT -55°C-+ 125°C >1000 cycles
COST
- Used in standard oven equipment
- Increase lifetime and reliability of your product, hence reduces risk of premature failures
- Room temperature storage
HSE
- Lead free
- No CMR containing substances
- No halogen
- No nano particles
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Our team is ready to advise you.