ECOREL SINTEC AP90D
Low-pressure sintering paste
- AG Sintering Paste
- Low Pressure Sintering Process
- For Large Area Dispensing
ECOREL SINTEC AP90D
Is a low-pressure sintering paste for flat-bed-dispensing process with silver as its main component. It has been developed for large area substrate-attach and high-power packages and allows only 1 step for complete module assembly. It offers lead free interconnections for large base plate sintering or components with die size up to 400mm2 with optimized wetting performance on DCB materials, gold, nickel, copper and silver surfaces.
Compatible with the temperature requirement mission profiles of wide band gap material SiC and GaN.
The sintering paste does not contain halogen nor nano particle and exhibits a very high shear strength. As key performance feature, it can be stored at room temperature without change of characteristics.
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PERFORMANCE
- High thermal conductivity to offer great heat dissipation
- Higher silver content than state-of-the art sinter pastes without agglomeration risk
- Very good wetting on all surface finishes
- High shear strength for improved reliability
- TCT -55°C-+ 125°C >1000 cycles
- 100% silver content post-sintering
COST
- All-in-one sintering reduces overall process cost
- Increase lifetime and reliability of your product, hence reduces risk of premature failures
- Room temperature storage ability
- Faster process with optimized BLT result
- Minimized paste loss compared to printing process
- Easier and adaptation for different designs
- Easy shipment due to non-dangerous goods
HSE
- Lead free
- No CMR containing substances
- No halogen
- No nano particles
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Our team is ready to advise you.